TekNational, Inc.
Tek-Sil® Gap Filler TSPGA-50A
Tek-Sil® TSPG-50A is a highly thermally conductive and low viscosity silicone compound.  It provides a thermal solution for the recent trends into smaller electronic devices.  Tek-Sil® TSPG-50A easily forms and adheres to most surfaces, shapes, and sizes of components.
Specific Gravity-3.2
Thermal ConductivityW/mK5.0
Volume ResistivityMO-m
Thermal Resistance°Cin²/W1.8
+70°C Aging1.0mm1.
+120°C Aging1.0mm1.
+150°C Aging1.0mm1.
-40°C aging1.0mm1.
+60°C 95%RH Aging1.0mm1.
-40°C to +125°C Heat Shock1.0mm1.

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled TSPG-A material's weight: 1.0mm - .09g: 2.0mm - 1.8g: 3.0mm - 2.6g

Viscosity under heat, cold, humid and thermal shock conditions.

UnitInitial1000 hrs later
+70°C AgingPa·s*1930020400
+120°C AgingPa·s*1930019400
+150°C AgingPa·s*1930024000
-40°C AgingPa·s*1930019500
+60°C 95%RH AgingPa·s*1930019700
-40°C to +125°C Heat ShockPa·s*1930020100

Accurate Rotary Viscometer (RV1)