- Products :
- Thermal Materials & Die Cutting :
- Thermal Grease and Gap Filler :
- Tek-Sil® Gap Filler :
Tek-Sil® Gap Filler TSPGA-50A
Tek-Sil® Gap Filler TSPGA-50A
Tek-Sil® TSPG-50A is a highly thermally conductive and low viscosity silicone compound. It provides a thermal solution for the recent trends into smaller electronic devices. Tek-Sil® TSPG-50A easily forms and adheres to most surfaces, shapes, and sizes of components.
| Property | Unit | TSPG-50A |
|---|---|---|
| Specific Gravity | - | 3.2 |
| Viscosity | Pa-s | 5000/19300 |
| Thermal Conductivity | W/mK | 5.0 |
| Volume Resistivity | MO-m | |
| Thermal Resistance | °Cin²/W | 1.8 |
| Gaps | Initial | 100hrs | 250hrs | 500hrs | 1000hrs | |
|---|---|---|---|---|---|---|
| +70°C Aging | 1.0mm | 1.7 | 1.7 | 1.7 | 1.7 | 1.7 |
| +120°C Aging | 1.0mm | 1.7 | 1.8 | 1.7 | 1.7 | 1.7 |
| +150°C Aging | 1.0mm | 1.7 | 1.7 | 1.8 | 1.8 | 1.8 |
| -40°C aging | 1.0mm | 1.8 | 1.8 | 1.9 | 1.9 | 1.9 |
| +60°C 95%RH Aging | 1.0mm | 1.8 | 1.8 | 1.8 | 1.8 | 1.7 |
| -40°C to +125°C Heat Shock | 1.0mm | 1.8 | 1.7 | 1.8 | 1.7 | 1.7 |
Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method
Contact surface: 3.14cm²(.49in²)
Filled TSPG-A material's weight: 1.0mm - .09g: 2.0mm - 1.8g: 3.0mm - 2.6g
Viscosity under heat, cold, humid and thermal shock conditions.
| Unit | Initial | 1000 hrs later | |
|---|---|---|---|
| +70°C Aging | Pa·s* | 19300 | 20400 |
| +120°C Aging | Pa·s* | 19300 | 19400 |
| +150°C Aging | Pa·s* | 19300 | 24000 |
| -40°C Aging | Pa·s* | 19300 | 19500 |
| +60°C 95%RH Aging | Pa·s* | 19300 | 19700 |
| -40°C to +125°C Heat Shock | Pa·s* | 19300 | 20100 |
Accurate Rotary Viscometer (RV1)
