TekNational, Inc.
Tek-Sil® Gap Filler TSPG-30A
Tek-Sil® TSPG-30A is a highly thermally conductive and high vicosity silicone compound.  It provides a thermal solution for the recent trends into smaller electronic devices.  Tek-Sil® TSPG-30A easily forms and adheres to most surfaces, shapes, and sizes of components.
PropertyUnitTSPG-30A
Specific Gravity-3.2
ViscosityPa-s2700
Thermal ConductivityW/mK3.2
Volume ResistivityMO-m1.0x106
Breakdown VoltagekV/mm15
Operating Temp Range°C-40 to +150
Thermal Resistance°Cin²/W0.3 at 1.0mm gap
GapsInitial100hrs250hrs500hrs1000hrs
1.0mm0.30.30.30.30.3
+150°C Aging2.0mm0.50.60.60.60.6
3.0mm0.80.80.90.90.9
1.0mm0.30.30.30.30.3
-40°C aging2.0mm0.50.50.50.50.5
3.0mm0.80.90.90.90.9
1.0mm0.30.30.30.30.3
+60°C 95%RH Aging2.0mm0.50.50.50.50.5
3.0mm0.80.80.80.80.8
1.0mm0.30.30.30.30.3
-40°C to +125°C Heat Shock2.0mm0.50.50.50.50.5
3.0mm0.80.90.90.90.9

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 1.0mm - .09g: 2.0mm - 1.8g: 3.0mm - 2.6g

Viscosity under heat, cold, humid and thermal shock conditions.

UnitInitial1000 hrs later
+150°C AgingPa·s*20003100
-40°C AgingPa·s*20002000
+60°C 95%RH AgingPa·s*20002000
-40°C to +125°C Heat ShockPa·s*20002000

* Accurate Rotary Viscometer (RV1)