TekNational - Tek-Sil® TSPG-30A

Tek-Sil® Gap Filler TSPG-30A

Tek-Sil® TSPG-30A is a highly thermally conductive and high vicosity silicone compound. It provides a thermal solution for the recent trends into smaller electronic devices. Tek-Sil® TSPG-30A easily forms and adheres to most surfaces, shapes, and sizes of components.

Property	Unit	TSPG-30A
Specific Gravity	-	3.2
Viscosity	Pa-s	2700
Thermal Conductivity	W/mK	3.2
Volume Resistivity	MO-m	1.0x10⁶
Breakdown Voltage	kV/mm	15
Operating Temp Range	°C	-40 to +150
Thermal Resistance	°Cin²/W	0.3 at 1.0mm gap

	Gaps	Initial	100hrs	250hrs	500hrs	1000hrs
	1.0mm	0.3	0.3	0.3	0.3	0.3
+150°C Aging	2.0mm	0.5	0.6	0.6	0.6	0.6
	3.0mm	0.8	0.8	0.9	0.9	0.9
	1.0mm	0.3	0.3	0.3	0.3	0.3
-40°C aging	2.0mm	0.5	0.5	0.5	0.5	0.5
	3.0mm	0.8	0.9	0.9	0.9	0.9
	1.0mm	0.3	0.3	0.3	0.3	0.3
+60°C 95%RH Aging	2.0mm	0.5	0.5	0.5	0.5	0.5
	3.0mm	0.8	0.8	0.8	0.8	0.8
	1.0mm	0.3	0.3	0.3	0.3	0.3
-40°C to +125°C Heat Shock	2.0mm	0.5	0.5	0.5	0.5	0.5
	3.0mm	0.8	0.9	0.9	0.9	0.9

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 1.0mm - .09g: 2.0mm - 1.8g: 3.0mm - 2.6g

Viscosity under heat, cold, humid and thermal shock conditions.

	Unit	Initial	1000 hrs later
+150°C Aging	Pa·s*	2000	3100
-40°C Aging	Pa·s*	2000	2000
+60°C 95%RH Aging	Pa·s*	2000	2000
-40°C to +125°C Heat Shock	Pa·s*	2000	2000

* Accurate Rotary Viscometer (RV1)

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