TekNational, Inc.
Tek-Sil® Gap Filler TSPG-20A
Tek-Sil® TSPG-20A is a highly thermally conductive, low viscosity silicone compound.  It provides a thermal solution for the recent trends into smaller electronic devices.  Tek-Sil® TSPG-20A easily forms and adheres to most surfaces, shapes, and sizes of components.
Specific Gravity-2.9
Thermal ConductivityW/mK2.0
Volume ResistivityMO-m1.0x106
Breakdown VoltagekV/mm15
Operating Temp Range°C-40 to +150
Thermal Resistance°Cin²/W2.1
+70°C Aging0.5mm2.
+120°C Aging0.5mm2.
+150°C Aging0.5mm2.
-40°C aging0.5mm2.
+60°C 95%RH Aging0.5mm2.
-40°C to +125°C Heat Shock0.5mm2.

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 0.5mm - .45g

Viscosity under heat, cold, humid and thermal shock conditions.

UnitInitial1000 hrs later
+70°C AgingPa·s*600600
+120°C AgingPa·s*600800
+150°C AgingPa·s*6001700
-40°C AgingPa·s*600300
+60°C 95%RH AgingPa·s*600600
-40°C to +125°C Heat ShockPa·s*600800

*Accurate Rotary Viscometer (RV1)