TekNational - Tek-Sil® TSPG-20A

Tek-Sil® Gap Filler TSPG-20A

Tek-Sil® TSPG-20A is a highly thermally conductive, low viscosity silicone compound. It provides a thermal solution for the recent trends into smaller electronic devices. Tek-Sil® TSPG-20A easily forms and adheres to most surfaces, shapes, and sizes of components.

Property	Unit	TSPG-20A
Specific Gravity	-	2.9
Viscosity	Pa-s	600
Thermal Conductivity	W/mK	2.0
Volume Resistivity	MO-m	1.0x10⁶
Breakdown Voltage	kV/mm	15
Operating Temp Range	°C	-40 to +150
Thermal Resistance	°Cin²/W	2.1

	Gaps	Initial	100hrs	250hrs	500hrs	1000hrs
+70°C Aging	0.5mm	2.1	2.1	2.1	2.1	2.1
+120°C Aging	0.5mm	2.1	2.0	2.0	2.1	2.1
+150°C Aging	0.5mm	2.1	2.0	2.0	2.1	2.1
-40°C aging	0.5mm	2.1	2.2	2.1	2.2	2.2
+60°C 95%RH Aging	0.5mm	2.2	2.2	2.2	2.2	2.3
-40°C to +125°C Heat Shock	0.5mm	2.1	2.2	2.5	2.6	2.6

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 0.5mm - .45g

Viscosity under heat, cold, humid and thermal shock conditions.

	Unit	Initial	1000 hrs later
+70°C Aging	Pa·s*	600	600
+120°C Aging	Pa·s*	600	800
+150°C Aging	Pa·s*	600	1700
-40°C Aging	Pa·s*	600	300
+60°C 95%RH Aging	Pa·s*	600	600
-40°C to +125°C Heat Shock	Pa·s*	600	800

*Accurate Rotary Viscometer (RV1)

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