TekNational, Inc.
Tek-Sil® Gap Filler TSPG-15A
Tek-Sil® TSPG-15A is a highly thermally conductive and high viscosity silicone compound.  It provides a thermal solution for the recent trends into smaller electronic devices.  Tek-Sil® TSPG-15A easily forms and adheres to most surfaces, shapes, and sizes of components.
PropertyUnitTSPG-15A
Specific Gravity-2.8
ViscosityPa-s2000
Flow Ratecc/min8
Thermal ConductivityW/mK1.5
Volume ResistivityMO-m1.0x10^6
Breakdown VoltagekV/mm10
Withstand VoltageKv/mm8
Flame RetardancyUL94V-O equivalent
TGA Weight Losswt%0.1
Operating Temp Range°C-40 to +150
Thermal Resistance°Cin²/W0.6 at 1.0mm gap
Compression Load/ModulusNPeak 19.6 /Sustain 1.0
GapsInitial100hrs250hrs500hrs1000hrs
1.0mm0.60.60.60.60.6
+150°C Aging2.0mm1.11.11.21.21.2
3.0mm1.61.91.91.91.9
1.0mm0.60.60.60.60.6
-40°C aging2.0mm1.11.11.11.11.1
3.0mm1.61.61.61.61.6
1.0mm0.60.60.60.60.6
+60°C 95%RH Aging2.0mm1.11.11.21.21.2
3.0mm1.61.91.91.91.9
1.0mm0.60.60.60.60.6
-40°C to +125°C Heat Shock2.0mm1.11.21.31.31.3

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 0.5mm - .45g

Viscosity under heat, cold, humid and thermal shock conditions.

UnitInitial1000 hrs later
+70°C AgingPa·s*600600
+120°C AgingPa·s*600800
+150°C AgingPa·s*6001700
-40°C AgingPa·s*600300
+60°C 95%RH AgingPa·s*600600
-40°C to +125°C Heat ShockPa·s*600800

*Accurate Rotary Viscometer (RV1)