- Products :
- Thermal Materials & Die Cutting :
- Thermal Grease and Gap Filler :
Tek-Sil® Thermal Grease
Tek-Sil® Thermally Conductive Grease
- Silicone and non-silicone formulations
- Low bleed and evaporation
- No migration for Tek-Sil® TSG-07NS and Tek-Sil® TSG-26NS
- Thin bond lines (1mil)
- Easy to apply
- Thermal conductivity up to 2.6 W/mºK
- Non-toxic
- Available in pre-filled Syringes: 3cc(6g), 10cc(28g) or 30cc(72g), 1lb(454g) jars
- Custom packaging available
Our Tek-Sil® silicone and non-silicone greases may be used between any heat generating semiconductor and heat sink, in high performance CPU's and power modules to name just a few uses.
| Typical Properties | Unit | TSG-07SL | TSG-26SL | TSG-07NS | TSG-26NS |
|---|---|---|---|---|---|
| Type | - | Silicone | Silicone | Non-Silicone | Non-Silicone |
| Specific Gravity @ 25°C | - | 2.2 | 2.2 | 2.4 | 2.4 |
| Viscosity* | Cps | 10000 | 95000 | 15000 | 85000 |
| Flow Rate** | grams/minute95 | 95 | 6 | 75 | 8 |
| Color | - | White | Gray | White | Gray |
| Evaporation @ 200°C, 24 hours | %/Wt | 0.52 | 0.44 | 0.68 | 0.5 |
| Thermal Conductivity | W/m °K | 0.75 | 2.6 | 0.75 | 2.6 |
| Volume Resistivity | Ohm-cm | 2.1x1014 | 2.8x1014 | 1.4x1014 | 2.1x1014 |
| Dielectric Strength | V/mil | 386 | 412 | 314 | 392 |
| Operating Temp Range | °C | -55 to 205 | -55 to 205 | -55 to 200 | -55 to 200 |
·Viscosity: Brookfield Viscometer, Spindle No. CP-51, 5 RPM.
··Flow test: 30cc Syringe, .09" orifice at 25 PSI.
Tek-Sil® TSG-07SL and TSG-26SL are highly thermally conductive silicone-based greases. They are non-reactive, maintain a nonflowable composition and offer low thermal resistance. Suited for thin bond line applications.
Tek-Sil® TSG-07NS and TSG-26NS are polysynthetic-based (non-silicone) thermal greases that have high thermal conductivity properties. They are non-migrating and infused with heat conductive metal oxides. Tek-Sil® non-silicone greases offer all the benefits of a silicone grease without contamination problems.