TekNational, Inc.
Tek-Sil® SH Materials

BETTER PERFORMANCE

Tek-Sil® SH has added fillers to improve thermal conductivity and dielectric strength.  "SH" materials are formulated using a fiber glass matrix to improve tear strength and puncture resistance.  Thermal conductivity for Tek-Sil® SH is 1.40 W/m-k, a 56% improvement compared to Tek-Sil® SR.  "SH" materials come in 4 thicknesses from .006" to .012".  Optional PSA is available.

Tek-Sil® SH Materials
PropertiesUnitSH-06SH-08SH-09SH-12
ColorvisualBrownBrownBrownBrown
Thicknessinches0.006 +/-.0050.008 +/-.0050.009 +/-.00050.012 +/-.005
Thicknessmm0.15 +.02/-.040.20 +.02/-.040.229 +/-.0130.30 +0.10/-0.0
MaterialbinderSiliconeSiliconeSiliconeSilicone
MaterialfillerAlumina + ALNAlumina + ALNAlumina + ALNAlumina + ALN
MaterialreinforcementFiberglassFiberglassFiberglassFiberglass
Thermal Resist.°Cin²/W0.550.57n/a0.61
Thermal Resist. w/PSA(1)°Cin²/W0.630.66n/a0.72
Specific Gravityg/cm³2.362.362.362.36
Hardness (ASTM D2240)Type A9292n/a95
Tensile StrengthkN/m8888
Elongation%2 or less2 or less2 or less2 or less
Tear StrengthkN/mn/an/an/an/a
Volume ResistivityMohm-m1.0x1071.0x1071.0x1071.0x107
Withstand VoltagekV/minute24n/a8
Dielectric Constant1KHz33.3n/a3.9
Maximum Use Temp.°C-60°C to +180°C-60°C to +180°C-60°C to +180°C-60°C to +180°C
Adhesive Coating-AvailableAvailableAvailableAvailable

(1) FTM P-3010 (ASTM D5470 Equivalent)